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NEPCM in High-Flux Electronics and Chip-Level Cooling


Problem Space:
Investigate the integration of NEPCM and microchannels for cooling microelectronic devices


Characterization of a Simple and Flexible Platform for Thermal Management Studies, in preparation for Applied Thermal Engineering.

Abstract:




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Publications

    Feasibility Assessment of the Integration of Microfluidics and NEPCM for Cooling Microelectronics Systems

    Abstract:


    The growing demand for microelectronic systems to be smaller and faster has increased the energy released by these devices in the form of heat. Microelectronic systems such as laptop computers and hand held devices are not exempted from these demands. The primary traditional technologies currently used to remove heat generated in these devices are fins and fans. In this study, traditional methods were compared to more novel methods like cooling using forced convection in microfluidic channels and stagnant nanoparticle enhanced phase change materials (NEPCM). For this study, the difference between the surface temperature of a simulated microelectronic system without any cooling and with a particular cooling method was compared for several cooling scenarios. Higher ΔT values indicate more effective cooling. The average ΔT values for fans, fins, NEPCM and microchannels with water were 2°C, 5°C, 3°C and 4°C respectively. These results suggest that, separately, microchannel cooling and NEPCM are promising methods for managing heat in microelectronic systems. Even more interesting than NEPCM or microchannel cooling alone is the potential cooling that can be achieved by combining the two methods to achieve multimode cooling first by the phase change of the NEPCM and then by circulating the nanofluid (melted NEPCM) through microchannels. A feasibility assessment, however, reveals that the combination of the two methods is not equal to the sum of the parts due to the viscosity and associated pumping power requirements for the melted phase change material. Nonetheless, the combination of the method still holds promise as a competitive alternative to existing thermal management solutions.

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    Investigation of Traditional and Novel Methods for Cooling Microelectronic Devices

    Abstract:


    The growing demand for microelectronic systems to be smaller and faster has increased the energy released by these devices in the form of heat. Microelectronic systems such as laptop computers and hand held devices are not exempted from these demands. The primary traditional technologies currently used to remove heat generated in these devices are fins and fans. In this study, traditional methods were compared to more novel methods like cooling using forced convection in microfluidic channels and stagnant nanostructure enhanced phase change materials (NEPCM). The first objective for this study was to develop a testing station to simulate the heating observed for microelectronic devices. This station consisted of an aluminum bar with a cartridge heater inserted. A power transformer provided power to the cartridge heater, which heated the aluminum bar to simulate a heated microelectronic device. Surface mounting thermocouples measured the temperature of the aluminum bar and either a multimeter, multi-thermocouple controller or automated data acquisition system reported the temperatures measured by the thermocouples. Additonally, the station was characterized using a lumped parameter analytical model. The experiments and model were in good agreement. After developing the test station, traditional cooling methods were studied. A fan powered by a 10 V power supply and an aluminum fin array with a total surface area of approximately 0.1 square meters were investigated. For these studies, the difference between the surface temperature of a simulated microelectronic system without any cooling and with a particular cooling method was compared for several cooling scenarios. Higher ΔT values indicate more effective cooling. The average ΔT values for the fans and fins studies were 2°C and 5°C, respectively. Next, novel cooling methods were investigated. The first novel cooling method investigated was NEPCM. The NEPCMs for this study were eicosane, a paraffin, infused with either copper oxide nanoparticles or carbon nanotubes to enhance the thermal conductivity. The second novel method investigated was microchannels with water as the cooling fluid. Results obtained from these studies indicated 4°C of cooling for both methods. These results suggest that, separately, microchannel cooling and NEPCM are promising methods for managing heat in microelectronic systems.

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    Publications

      Lumped Parameter Modeling of a Platform for Thermal Management Studies

      Abstract:


      The objective of this work was to develop an analytical model of a platform for thermal management studies. The platform consists of an aluminum bar with a heater cartridge inserted and surface mounting thermocouples attached. The bar may also be covered with fiberglass insulation to manipulate the temperature and corresponding heat flux of the system beyond what can be achieved by adjusting the power to the heater cartridge. The surface mounting thermocouples are attached to a data acquisition system that records the temperature at selected intervals. Various cooling methods can be coupled to the aluminum bar and tested in order to ultimately characterize cooling methods for thermal management of microelectronic devices. However, this study is restricted to experiments and analytical modeling of the platform without a cooling method coupled. For this study, a lumped parameter model predicted the temperature of the heated aluminum bar. Because the thermal conductivity (k) of aluminum is high and the free convection heat transfer coefficient (h) is low, the lumped parameter model is applicable. Results from the model and experiments were compared and are in good agreement.

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      Publications